'Throughput the period the Company continued to refine the capabilities of its ASIC, electronic controls, software algorithms, the chip assembly and packaging process as well as our proprietary measurement systems. To better cope with the receipt of what are expected to be fully functioning wafers and the ensuing demonstration and introduction phases, management has been actively seeking to expand its engineering workforce. Management continues to maintain very active communications with its ever growing pool of future customers, ranging from industry conglomerates to startup’s wanting to utilise our devices for a wide range of new and fascinating applications.'
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