AP has confirmed they want approved quality MEMS from either source as soon as they can get them. This will provide them with integrated chips they can test very rapidly.
I also noted from the patent docs that the EPO has just accepted the updated European patent application and issued it with an "intention to grant" notice. NB: this is not granting the patent yet. That will take a while longer, but it protects the latest tech and sets a number of things in concrete.
https://hotcopper.com.au/attachments/e1i1hp024683dsu-2-pdf.986350/
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